Raspberry Pi cuts product returns by 50% by changing up its pin soldering

Comments

• jesta@lemmy.world ⁨6⁩ ⁨days⁩ ago

  They now use intrusive soldering that solders surface mount and through-hole components at the same time:

  The idea behind intrusive soldering, also known as pin-in-paste soldering is simple: solder paste is printed onto or around a through-hole pad, and the through-hole component is passed into reflow with your SMD components. The molten solder paste then fills in the through-hole and attaches the component pin.

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  • rtxn@lemmy.world ⁨6⁩ ⁨days⁩ ago

    I used to work on an SMT line, and pin in paste was the bane of my fucking existence. The parts (mainly connectors) were rarely within tolerance, and a leg or two would consistently miss their holes, if not outright rejected by the inserter.

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    • yggstyle@lemmy.world ⁨6⁩ ⁨days⁩ ago

      So if I’m reading that right - higher failure rate on the line but those that passed I’d imagine have a higher rate of success?

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    • ozymandias117@lemmy.world ⁨6⁩ ⁨days⁩ ago

      So, would your suspicion be that it’s causing them more failed boards in production?

      I guess if it’s reducing returns, that might be something they’re accepting as a tradeoff?

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    • Goretantath@lemm.ee ⁨6⁩ ⁨days⁩ ago

      How long ago was this? Could the process have become more acurate in the time you’ve been away from it?

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• ogmios@sh.itjust.works ⁨6⁩ ⁨days⁩ ago

  I was really confused by the headline for a minute until I realized they were talking about products returned instead of profits returned.

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• riquisimo@lemmy.dbzer0.com ⁨6⁩ ⁨days⁩ ago

  Cool stuff!

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