I don’t think thermal paste is the problem here, the whole box is god damn hot, so it conducts heat well. At wall it measures 14-15w consumption, got it there from like 20-22w that was on defaults. Given that N150 is 6W TDP, the whole system just runs hot.
A fan would help, but I wanted fanless for a reason.
TDP is a very misunderstood concept these days because it used to be a hard upper limit but now it’s god knows what. The Spec Sheet is calling it “Processor Base Power”. What might that be you ask? Well of course it is
The time-averaged power dissipation that the processor is validated to not exceed during manufacturing while executing an Intel-specified high complexity workload at Base Frequency and at the junction temperature as specified in the Datasheet for the SKU segment and configuration.
In other words it’s just marketing mumbo jumbo. According to other users the N150 can draw as much as 20 up to 35 watts even. The fact that the heat is radiating well through your case sounds like a positive if anything. This is x86 we’re talking about. The added complexity of that architecture over ARM comes at a price.
the really shitty thermal paste - pack some Arctic Silver onto that bad boy and if you can -increase the heat sink size or type - I don’t know what kind of room you have to work with.
utjebe@reddthat.com 4 months ago
I don’t think thermal paste is the problem here, the whole box is god damn hot, so it conducts heat well. At wall it measures 14-15w consumption, got it there from like 20-22w that was on defaults. Given that N150 is 6W TDP, the whole system just runs hot.
A fan would help, but I wanted fanless for a reason.
desentizised@lemmy.zip 4 months ago
TDP is a very misunderstood concept these days because it used to be a hard upper limit but now it’s god knows what. The Spec Sheet is calling it “Processor Base Power”. What might that be you ask? Well of course it is
In other words it’s just marketing mumbo jumbo. According to other users the N150 can draw as much as 20 up to 35 watts even. The fact that the heat is radiating well through your case sounds like a positive if anything. This is x86 we’re talking about. The added complexity of that architecture over ARM comes at a price.
umbrella@lemmy.ml 4 months ago
Zedd_Prophecy@lemmy.world 4 months ago
the really shitty thermal paste - pack some Arctic Silver onto that bad boy and if you can -increase the heat sink size or type - I don’t know what kind of room you have to work with.