Nope. Larger chips, lower yields in the fab, more expensive. This is why we have chiplets in our CPUs nowadays. Production cost of chips is superlinear to size.
Nope. Larger chips, lower yields in the fab, more expensive. This is why we have chiplets in our CPUs nowadays. Production cost of chips is superlinear to size.
earphone843@sh.itjust.works 1 day ago
Then lower the storage density. Making things as small as possible almost always ends up being more expensive.
enumerator4829@sh.itjust.works 1 day ago
Not economical. Storage is already done on far larger fab nodes than CPUs and other components. This is a case where higher density actually can be cheaper. ”Mature” nodes are most likely cheaper than the ”ancient” process nodes simply due to age and efficiency. (See also the disaster in the auto industry during covid. Car makers stopped ordering parts made on ancient process nodes, so the nodes were shut down permanently due to cost. After covid, fun times for automakers that had to modernise.)
Go compare prices, new NVMe M.2 will most likely be cheaper than SATA 2.5” per TB. The extra plastic shell, extra shipping volume and SATA-controller is that difference. 3.5” would make it even worse. In the datacenter, we are moving towards ”rulers” with 61TB available now, probably 120TB soon. Now, these are expensive, but the cost per TB is actually not that horrible when compared to consumer drives.
jj4211@lemmy.world 18 hours ago
Lower storage density chips would still be tiny, geometry wise.
A wafer of chips will have defects, the larger the chip, the bigger portion of the wafer spoiled per defect. Big chips are way more expensive than small chips.
No matter what the capacity of the chips, they are still going to be tiny and placed onto circuit boards. The circuit boards can be bigger, but area density is what matters rather than volumetric density. 3.5" is somewhat useful for platters due to width and depth, but particularly height for multiple platters, which isn’t interesting for a single SSD assembly. 3.5 inch would most likely waste all that height. Yes you could stack multiple boards in an assembly, but it would be better to have those boards as separately packaged assemblies anyway (better performance and thermals with no cost increase).
So one can point out that a 3.5 inch foot print is decently big board, and maybe get that height efficient by specifying a new 3.5 inch form factor that’s like 6mm thick. Well, you are mostly there with e3.l form factor, but no one even wants those (designed around 2U form factor expectations). E1.l basically ties that 3.5 inch in board geometry, but no one seems to want those either. E1.s seems to just be what everyone will be getting.