Amd’s chiplets are different from Intel’s.
AMD’s chipltets are discrete “modules” that are physically separate from each other.
Intel is trying to make an almost monolithic die, but using distinct chips sitting directly next to each other with (I believe) an almost direct link.
AMD’s chiplet design isn’t very good for low power low load uses (like laptops) while Intel’s approach should be much better for laptops. Sapphire rapids is closer to AMD’s chiplet design, but dear god do those CPUs use a lot of power.
TheGrandNagus@lemmy.world 1 year ago
For years. 2017 if you argue the separate CCXs in Zen1 Threadripper to be chiplets.
2019 with Zen2 if you’re not counting that.
AMD is pretty ahead of everyone when it comes to packaging tech.
SharkAttak@kbin.social 1 year ago
Next thing they'll declare to be the first to use 3D packaging in their CPUs.