Comment on Xbox 360/PS3/(to a lesser extent) Wii owners represent

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heythatsprettygood@feddit.uk ⁨1⁩ ⁨day⁩ ago

Wii was mostly okay, but boards with a 90nm Hollywood GPU are somewhat more likely to fail than later 65nm Hollywood-A boards (so RVL-CPU-40 boards and later), especially if you leave WiiConnect24 on as it keeps the Starlet ARM chip inside active even in fan off standby - most 90nm consoles will be okay due to low operating temperatures, but some (especially as thermal paste ages and dust builds) are more likely to die due to bumpgate related problems.

PS3s did crap out with yellow lights of death, although not as spectacularly as 360 red rings (lower proportion due to beefier cooling and different design making the flaws less immediately obvious, but still a problem). NVIDIA on the RSX made the same mistakes as ATI on the Xenos - poor underfill and bump choice that could not withstand the thermal cycles, which should have been caught (NVIDIA and bumpgate is a whole wild story in and of itself though, considering it plagued their desktop and mobile chips). The Cell CPU on there is very reliable though, even though it drew more power and consequently output more heat - it was just the GPU that could not take the heat.

360s mostly red ringed due to faulty GPUs, see previous comments about the PS3 RSX. ATI had a responsibility to choose the right materials, design, and packaging partner to ship to Microsoft for final assembly, and so they must take some responsibility (they also, like NVIDIA, had troubles with their other products at this time, leading to high failure rates of devices like the early MacBook Pros). However, it is unknown if they are fully to blame, as it is unknown who made the call for the final package design.

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